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pc956l0nsz series 1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc956l ) 2. approved by vde (vde0884) (as an option) file no. 87446 (as model no. pc956l ) 3. package resin : ul flammability grade (94v-0) features agency approvals/compliance 1. programmable controller 2. inverter applications high speed 2mb/s, high cmr dip 8 pin ? opic photocoupler 1. 8 pin dip package 2. double transfer mold package (ideal for flow soldering) 3. high noise immunity due to high instantaneous com- mon mode rejection voltage (cm h : min. 15kv/ s, cm l : min. ? 15kv/ s) 4. high speed response (t phl : typ. 210 ns, t plh : typ. 400 ns) 5. high isolation voltage between input and output (v iso(rms) : 5.0 kv) description pc956l0nsz series contains a led optically cou- pled to an opic chip. it is packaged in a 8 pin dip, available in smt gullwing lead form option. input-output isolation voltage(rms) is 5.0kv, high speed response (typ. 2mb/s) and cmr is min. 15kv/ s. 1 sheet no.: d2-a05501en date nov. 28. 2003 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. pc956l0nsz series ? "opic"(optical ic) is a trademark of the sharp corporation. an opic consists of a light-detecting element and a signal-processi ng circuit integrated onto a single chip.
internal connection diagram 8 7 6 5 1 2 3 4 1 2 3 4 5 6 7 8 amp. nc anode cathode nc v l gnd v o v cc voltage regulator 2 sheet no.: d2-a05501en outline dimensions product mass : approx. 0.51g (unit : mm) 1. through-hole [ex. pc956l0nsz ] 2. through-hole (vde0884 option) [ex. pc956l0ysz ] 3. smt gullwing lead-form [ex. PC956L0NIP ] 4. smt gullwing lead-form (vde0884 option) [ex. pc956l0yip ] pc956l 2.54 0.25 8 7 6 5 primary side mark 6.5 0.5 0.85 0.2 1.2 0.3 9.66 0.5 3.5 0.5 0.5 0.1 0.5 typ. 1 2 3 4 3.05 0.5 3.4 0.5 : 0 to 13 ? 7.62 0.3 0.26 0.1 epoxy resin date code pc956l 4 vde0884 identification mark 2.54 0.25 8 7 6 5 primary side mark 6.5 0.5 0.85 0.2 1.2 0.3 9.66 0.5 3.5 0.5 0.5 0.1 0.5 typ. 1 2 3 4 3.05 0.5 3.4 0.5 : 0 to 13 ? 7.62 0.3 0.26 0.1 epoxy resin date code pc956l 0.85 0.2 1.2 0.3 primary side mark 7 8 6 5 4 6.5 0.5 1 2 3 2.54 0.25 3.5 0.5 1.0 + 0.4 ? 0 0.26 0.1 epoxy resin 10.0 + 0 ? 0.5 1.0 + 0.4 ? 0 0.35 0.25 7.62 0.3 9.66 0.5 date code pc956l 4 0.85 0.2 1.2 0.3 7 8 6 5 4 6.5 0.5 vde0884 identification mark 1 2 3 2.54 0.25 3.5 0.5 1.0 + 0.4 ? 0 0.26 0.1 epoxy resin 10.0 + 0 ? 0.5 1.0 + 0.4 ? 0 0.35 0.25 7.62 0.3 9.66 0.5 date code primary side mark pc956l0nsz series
date code (2 digit) a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production 3 repeats in a 20 year cycle sheet no.: d2-a05501en pc956l0nsz series country of origin japan
sheet no.: d2-a05501en electro-optical characteristics * 6 parameter symbol unit input v a operating supply voltage low level output current high level supply current t a = 25?c, v = 0, f = 1mhz pf output v ol v cc i ol high level output current i oh i cch low level supply current i ccl ma ma transfer characteristics "high low" input threshold current isolation resistance floating capacitance internal pull-up resistance i fhl r iso c f r l ma ? pf k ? t plh ns t phl ns propagation delay skew ? tw ns distortion of pulse width t psk ns instantaneous common mode rejection voltage (high level output) t a = 25?c, i f = 10ma, v cc = 15v, c l = 100pf, v cm = 1.5kv (p-p) , r l = 20k ? , v o < 1.0v, short circuit between pin and pin instantaneous common mode rejection voltage (low level output) cm l kv/ s t a = 25?c, i f = 10ma t a = 25?c, v r = 5v min. ? ? ? 5 10 10 ? 14 30 270 ? ? ? ? ? ? 15 max. 10 250 1.3 1.3 5 ? 1 25 450 450 ? 1.95 400 550 conditions "low high" propagation delay time "high low" propagation delay time response time cm h ? i f = 10ma, v o = 0.6v i f = 0, v cc = v o i f = 10ma, i o = 2.4ma i f = 0, v o = open i f = 10ma, v o = open v o = 0.8v, r l = 20k ? , v cc = 15v short circuit between pin and pin t a = 25?c, dc500v, 40 to 60%rh t a = 25?c, v = 0, f = 1mhz t a = 25?c i f = 10ma (t phl ), i f = 0 (t plh ), v cc = 15v, r l = 20k ? , c l = 100pf v thlh = 2.0v, v thhl = 1.5v short circuit between pin and typ. ? v 4.5 35 ? 60 v ? 0.6 0.3 0.6 ma 4.4 ? 9 a ? 50 5 0.8 1.5 10 11 0.6 20 190 200 1.6 210 400 kv/ s 15 ? 30 ? 30 (unless otherwise specified t a =? 40 to + 85?c, v cc = 4.5 to 35v) low level output voltage forward voltage reverse current terminal capacitance v f i r c t *6 it shall connect a by-pass capacitor of 0.01 f or more between v cc (pin 8 ) and gnd (pin 5 ) near the device, when it measures the transfer characteristics and the output side characteristics *7 distortion of pulse width ? tw = | t phl ? t plh | 7 7 8 7 8 t a = 25?c, i f = 0, v cc = 15v, c l = 100pf, v cm = 1.5kv (p-p) , r l = 20k ? , v o > 3.0v, short circuit between pin and pin 7 8 8 pin absolute maximum ratings parameter symbol rating unit forward current i f 25 ma ma reverse voltage input output v r 5v v power dissipation p45 supply voltage output voltage output current power dissipation 100 15 mw mw v o p o i o v v cc v iso (rms) kv operating temperature t opr ? 55 to + 125 ? 40 to + 85 ? 0.5 to + 35 ? 0.5 to + 35 ?c ?c storage temperature isolation voltage t stg *4 *3 *2 *1 *5 soldering temperature t sol 270 5.0 ?c (t a = 25?c) *1 when ambient temperature goes above 70?c, the power dissipation goes down at approx. 0.5ma/?c.(fig.3) *2 when ambient temperature goes above 70?c, the power dissipation goes down at approx. 0.8mw/?c.(fig.4) *3 when ambient temperature goes above 70?c, the power dissipation goes down at approx. 1.8mw/?c.(fig.4) *4 40 to 60%rh, ac for 1minute, f = 60hz *5 for 10s 4 pc956l0nsz series
sheet no.: d2-a05501en model line-up pc956l0nsz pc956l0ysz ?????? approved PC956L0NIP pc956l0yip lead form package model no. vde0884 sleeve taping through-hole 50pcs/ sleeve 1 000pcs/ reel smt gullwing ?????? approved 5 please contact a local sharp sales representative to inquire about production status and lead-free options. pc956l0nsz series
sheet no.: d2-a05501en fig.4 power dissipation vs. ambient temperature fig.3 forward current vs. ambient temperature 6 pc956l0nsz series fig.1 test circuit for propagation delay time fig.2 test circuit for common mode rejection voltage t phl t plh t f 90% 10% i f r l gnd c l 0.1 f v ol v thlh v thhl 10ma 0ma i f v o v o v cc 47 ? amp. voltage regulator t r 1.5kv 0v v cm cm h ,v o cm l ,v o (i f = 0) (i f = 10ma) sw is a sw is b v cc v o (min.) v o (max.) v ol v cm +? a b r l gnd c l 0.1 f i f v o v cc amp. voltage regulator forward current i f (ma) ambient temperature t a (?c) 0 5 10 15 20 25 ? 40 0 25 50 75 100 125 ? 25 85 70 power dissipation p, p o (mw) ambient temperature t a (?c) 0 20 40 45 60 80 100 ? 40 0 25 50 100 125 ? 25 p p o 75 85 70
sheet no.: d2-a05501en fig.10 supply current vs. ambient temperature fig.9 low level output voltage vs. ambient temperature fig.7 relative output current vs. ambient temperature fig.8 input threshold current vs. ambient temperature 7 pc956l0nsz series fig.5 output current vs. forward current fig.6 forward current vs. forward voltage output current i o (ma) 0 15 10 5 05 15 10 20 forward current i f (ma) v o = 0.6v t a =? 40?c t a = 25?c t a = 100?c t a = 75?c forward voltage v f (v) forward current i f (ma) 1 10 100 0.1 1.0 1.2 1.4 1.6 1.8 2.0 t a = 75?c t a = 50?c t a = 25?c t a = 0?c t a =? 20?c t a =? 40?c ? 40 0 ? 20 60 80 40 20 100 supply current i cch , i ccl (ma) 0.0 1.6 0.6 0.4 0.2 1.2 1.4 0.8 1.0 ambient temperature t a (?c) v cc = 35v v o = open i cch :i f = 0 i ccl :i f = 10ma i ccl i cch relative output current i o (%) 60 120 70 100 110 80 90 ? 40 0 ? 20 60 80 40 20 100 ambient temperature t a (?c) i f = 10ma v o = 0.6v i o = 100% at t a = 25?c ? 40 0 ? 20 60 80 40 20 100 input threshold current i fhl (ma) 0.0 5.0 2.0 3.0 4.0 ambient temperature t a (?c) v cc = 15v v o = 0.8v r l = 20k ? 1.0 ? 40 0 ? 20 60 80 40 20 100 low level output voltage v ol (v) 0.0 0.6 0.3 0.4 0.5 ambient temperature t a (?c) v cc = 4.5v i f = 10ma i o = 2.4ma 0.2 0.1
sheet no.: d2-a05501en fig.13 propagation delay time vs. load capacitance fig.14 propagation delay time vs. supply voltage fig.15 propagation delay time vs. forward current 8 pc956l0nsz series fig.12 propagation delay time vs. load resistance fig.11 propagation delay time vs. ambient temperature remarks : please be aware that all data in the graph are just for reference and not for guarantee. ? 40 0 ? 20 60 80 40 20 100 propagation delay time t phl , t plh ( s) 0 2.0 0.2 0.4 1.8 0.6 0.8 1.0 1.2 1.4 1.6 ambient temperature t a (?c) t plh t phl i f = 10ma v cc = 15v c l = 100pf r l = 20k ? propagation delay time t phl , t plh ( s) 0 2.0 0.2 0.4 1.8 0.6 0.8 1.0 1.2 1.4 1.6 04 2101618 14 12 8 620 forward current i f (ma) t plh t phl v cc = 15v c l = 100pf r l = 20k ? t a = 25?c propagation delay time t phl , t plh ( s) 0 2.0 0.2 0.4 1.8 0.6 0.8 1.0 1.2 1.4 1.6 load resistance r l (k ? ) i f = 10ma v cc = 15v c l = 100pf t a = 25?c t plh t phl 0510 15 20 25 30 35 40 45 50 propagation delay time t phl , t plh ( s) 0 2.0 0.2 0.4 1.8 0.6 0.8 1.0 1.2 1.4 1.6 0 100 50 300 350 400 450 250 200 150 500 load capacitance c l (pf) i f = 10ma v cc = 15v r l = 20k ? t a = 25?c t plh t phl propagation delay time t phl , t plh ( s) 0 2.0 0.2 0.4 1.8 0.6 0.8 1.0 1.2 1.4 1.6 010 52530 20 15 35 supply voltage v cc (v) i f = 10ma c l = 100pf r l = 20k ? t a = 25?c t plh t phl
sheet no.: d2-a05501en 9 pc956l0nsz series design considerations transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute de- sign. when handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. notes about static electricity in order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01 f or more between v cc and gnd near the device. in case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through led or current may change. if the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of led. the detector which is used in this device, has parasitic diode between each pins and gnd. there are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below gnd level even for instant. therefore it shall be recommended to design the circuit that electric potential of any pin does not become below gnd level. this product is not designed against irradiation and incorporates non-coherent led. design guide recommended operating conditions parameter forward current supply voltage output voltage min. typ. ? ? ? ? max. 20 35 35 unit ma v v symbol i f v cc v o operating temperature 70 10 4.5 0 ? 40 ?c t opr
sheet no.: d2-a05501en ? for additional design assistance, please review our corresponding optoelectronic application notes. 10 pc956l0nsz series degradation in general, the emission of the led used in photocouplers will degrade over time. in the case of long term operation, please take the general led degradation (50% degradation over 5years) into the design consideration. please decide the input current which become 2times of max. i fhl . recommended foot print (reference) 2.54 2.54 1.7 2.2 8.2 2.54 (unit : mm)
sheet no.: d2-a05501en manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 11 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) pc956l0nsz series
sheet no.: d2-a05501en solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this device. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. presence of odc 12 pc956l0nsz series
sheet no.: d2-a05501en package specification 13 12.0 6.7 5.8 10.8 520 2 sleeve package package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 50 pcs. of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its primary side mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions (unit : mm) pc956l0nsz series
sheet no.: d2-a05501en 14 tape and reel package package materials carrier tape : a-pet (with anti-static material) cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j g b h h a c dimensions list (unit : mm) a 16.0 0.3 b 7.5 0.1 c 1.75 0.1 d 12.0 0.1 e 2.0 0.1 h 10.4 0.1 i 0.4 0.05 j 4.2 0.1 k 10.2 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 5? max. a c e g f b d dimensions list (unit : mm) a 330 b 17.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 pull-out direction [packing : 1 000pcs/reel] reel structure and dimensions direction of product insertion pc956l0nsz series
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems rela- ted to any intellectual property right of a third party re- sulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the spec- ifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufac- turing locations are also subject to change without no- tice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: - -- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high lev- el of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment - -- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall with- in the scope of strategic products described in the for- eign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp de- vices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, elec- tronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. 15 sheet no.: d2-a05501en important notices pc956l0nsz series

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